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Introduction
• STATS ChipPAC Ltd. is a premier service
provider of semiconductor packaging design,
assembly, test and distribution solutions.
• To maintains efficiency, all machine for all
department must be at the greatest status
• In IC Assembly FOL, Preventive Maintenance
is one of the way to maintains efficiency for
Gold Wire Bonding machine
Stats Chippac
Malaysia
( SCM )
SCM History & Milestone
Started Operation - 1974
Land Area - 18 acres B3 B2
B1
Floor Space - 483,000 sq. ft. Plant Layout
Team Members - 2300
Services - Analog, RF & Mixed Signal Testing
- LFCSP & BCC Portfolio Additions
- Discrete Power Assembly & Test
- Product Logistics & Distribution
Production Capacity - 25 Million units per week
ChipPAC
1974 1989 1999 2000
2004
Stats ChipPAC Malaysia Organization
HS Lew
President / MD
LA Khoo Prembaj
KK Wong CL Tan
Sr. Director V.P.
Sr. Director Director
IC Assembly Engg & Test
IC Assembly Power
New Product Operations
Operations Operations
Introduction
ST Goh
Ronnie Ong Director Terence Chin
Director CS, Ind. Engg, Director
QRA Product Planning IT & Facilities
& Logistics
Janet Wong
Director FL Seow Baharom
Procurement, Deputy Director Director
Matls Planning Finance HR
& Warehousing
Process Flow IC FOL
IC Assembly Coverlay
Die Bank (QFNs)
Pre Bond
Wafer Detapping Plasma Cleaning
(QFNp)
Post Bond
Wafer Mount Plasma Cleaning
(QFNs)
Wafer Saw 3rd Optical Inspection
Customer’s
requirement
2nd Optical Inspection
According to
package
Proper Outfit To Enter Clean Room –
IC Assembly
Finger cots
BCC – BUMP CHIP CARRIER QFNp – QUAD FLAT NO LEAD PUNCH QFNs – QUAD FLAT NO LEAD SAWN
EPOXY
Die TIE BAR
BOND PAD
BOND PAD
EPOXY
LEAD
DIE
LEAD
MOUNTING PAD
Lead
PADDLE
DIE
EPOXY GROUND RING
Gold Wire Bonding Machine – K&S 8028
Signal Tower LCD Monitor
Butang kecemasan
XY Table
Microscope
MHS Input. Bond head
Magazine Handler
Numeric Keypad
Power Control
1. CLEANING Purpose/Scope
OPERATORS
for
LINE MAINTENANCE
2. EXAMINE Preventive
PM TECHNICIANS
3. SMALL RECOVERY
Maintenance
ENGINEERS / CI TEAM
4. REPAIRING
5. MAINTENANCE
6. CALIBRATING
7.
BUY- OFF
8.
CONTINUES EFFICIENCY
PM work flow i.
ii.
Acknowledge PM
Switch - OFF machine
iii. Opening covers
Machine on PM iv. Cleaning machine using vacuum cleaner
v. Greasing Rails/Sliders
due date vi. Removing stains (using Methanol chemical)
vii. Switch – ON machine
Setup
i. Go to AUTO menu
ii. Run/Stop bonding
iii. Correct Crosshair-offset on pad
Test bond
i. Up & Lot Start
ii. Check the bonding program (must PASSED)
iii. Check list and dummy is ready to send to
QC
Ready for production
(MA)
Conclusion