Name: SADEQ ALI QASEM MOHAMMED Matrix No: DE080205 Industrial Supervisor: Dr.

Nafarizal Nayan Faculty Supervisor: Dr. Khairun Nidzam Bin Ramli

HISTORY

Microelectronics& Nanotechnology - Shamsuddin Research Centre or MiNT-SRC is one of the Center of Excellence at University Tun Hussein Onn Malaysia (UTHM). It was established in November 27th, 2006. Formerly it was known as Microelectronic and Nanotechnology Centre (MiNTEC). In November 25th, 2007, the name of Microelectronic & Nanotechnology - Shamsuddin Research Center was effective as an acknowledgment to our university's former chairman Y. Bhg. Tan Sri Dato' Seri Ir Shamsuddin bin Abdul Kadir for his contribution to the university (2007-2009). He is currently appointed as first Pro-Chancellor of UTHM

Electrical and Electronic Engineering dean prof. HJ. AYOB BIN HJ. JOHARI

Deputy Dean Of Faculty Electrical and Electronic Engineering

Microelectronic Laboratory (En. Ahmad Nasrull Mohamed)

Digital System Design Laboratory (En. Hasnah Rahmad)

Thin Film Technology (Dr. nafarizal Nayan)

Biomedical Engineering (En. Ahmed Alabqari Ma'Radzi)

Nanolithography Technology (Dr. Mohd Arif Agam)

VLSI Design& Microelectronic (En. Mohd Suhaimi Sulong)

 To

relate the theory learnt in university to the practical training in the program. To provide the student an opportunity to get an early exposure in the industry. To improve the communication skills of the student. To boost up the confident level of the student.

magnetron sputtering this machine uses DC and RF sputtering to coat the glass in order to make a thin film the Method of depositing thin films by sputtering that is ejecting material from a "target" that is source, then deposits onto a "substrate," such as a silicon wafer. Re-sputtering is reemission of the deposited material during the deposition process by ion or atom bombardment.

The RF diode sputtering system requires an impedance-matching network between the power supply and the discharge chamber. In the RF discharge system the operating pressure is lowered to as low as 1mTorr, since the RF electric field in the discharge chamber increases the collision probability between secondary electrons and gas molecules

RIE system consists of a cylindrical vacuum chamber, with a wafer platter situated in the bottom portion of the chamber. The wafer platter is electrically isolated from the rest of the chamber, which is usually grounded. Gas enters through small inlets in the top of the chamber, and exits to the vacuum pump system through the bottom. The types and amount of gas used vary depending upon the etch process.

Evaporation is a common method of thin film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel directly to the target object (substrate), where they condense back to a solid state. Evaporation is used in microfabrication, and to make macro-scale products such as metallized plastic film.

It measure thin-film thickness by analyzing how light is reflected by the film. By analyzing wavelengths beyond those visible to the human eye it can measure nearly all non-metallic films greater than 100 atoms thick. And because there are no moving parts, results are available in seconds: film thickness, refractive index, even roughness.

Atomic force microscopy (AFM) or scanning force microscopy (SFM) is a very high-resolution type of scanning probe microscopy, with demonstrated resolution on the order of fractions of a nanometer, more than 1000 times better than the optical diffraction limit. This device have many image mode as 3D image mode, gain image mode and some more.

Surface Profiler is a measuring instrument used to measure surface's profile, in order to quantify its roughness. A diamond stylus is moved vertically in contact with a sample and then moved laterally across the sample for a specified distance and specified contact force. A Surface Profiler can measure small surface variations in vertical stylus displacement as a function of position. A typical Surface Profiler can measure small vertical features ranging in height from 10 nanometers to 1 millimeter.

A field-emission cathode in the electron gun of a scanning electron microscope provides narrower probing beams at low as well as high electron energy, resulting in both improved spatial resolution and minimized sample charging and damage. For applications which demand the highest magnification possible.

Plasma is partially ionized gases consisting of ions, electrons, free radicals and neutral species. This ionized gas mixture is conductive and highly reactive, which provides the basis for the plasma process.

In circuit board applications the panels are suspended between electrodes. process gas is introduced and the electrodes are energized with RF energy. This initiates the plasma.

The Atmospheric pressure plasma (APP) will be generated by using dielectric-barrier discharge which is the easiest way to generate the APP, got many planner design of dielectric-barrier discharge.

at least one dielectric barrier these discharges require alternating voltages for their operation. The dielectric, being an insulator, cannot pass a dc current. Its dielectric constant and thickness, in combination with the time derivative of the applied voltage, dU/dt, determine the amount of displacement current that can be passed through the dielectric( s). To transport current (other than capacitive) in the discharge gap the electric field has to be high enough to cause breakdown in the gas.

A clean room is a specially constructed enclosed area environmentally controlled with respect to airborne particulate, air temperature, humidity, air pressure, airflow pattern, air motion electromagnetic signals and lighting. Its typically use in manufacturing or scientific research that has a low level of environmental pollutants such as dust, airborne microbes, aerosol particles and chemical vapors. More accurately, a clean room has a controlled level of contamination that is specified by the number of particles per cubic meter and by maximum particle size.

Clean room consist of one partition or room which surrounded by a return air chamber. RAC (Return Air Chamber) is needed to allow the air flow below the raised floor return to FFU (Fan Filter Unit). The sizes of return air chamber is very important, because the rate of fresh air volume needed to supply back to the clean room must be less than the volume of the RAC. In other words, the RAC must be able to supply the volume of air needed back to the clean room. Air flow in the RAC is at different direction as inside the clean room which is facing up; this is due to the suction of the FFU at the top of the clean room. The schematic of clean room at Media of M1 and M2 plants are shown

Communication Skills Time Management

Teamwork Reporting

Safety Training & Awareness

Problem Solving Skill

 For

MiNT-SRC ~ Training should be well planned

For

University ~ Organize an industrial talk

 All

objectives were successfully achieved. Various lessons learned and experience gained. Learn the work culture A success Industrial internship program

THANK YOU