PACKAGING

What is Electronic Packaging?

Packaging provides the interconnection Chip Protection Environmental, thermal, mechanical Communication Maximize I/O Power Heat removal

WHAT IS PACKAGING?
Packaging refers to The packaging of the interconnected chips The interconnection for signal transmission, power & ground The encapsulation for protecting the chips The heat sinks or the other cooling devices The housing for electromagnetic interference shielding

Goals of Electronic Packaging

Maximize I/O Minimize thermal issues Heat dissipation Thermal stress Environmental protection and encapsulation Lowest cost needed to get results Drive to continuously reduce size and power
Talk by DL Thomas of Endicott

Performance
Cycle Time Circuit Delay Circuit Technology (W/cm2) Chip Power cooling Package Delay Circuit Density I/O (Connections/cm2) Wireability (Lines/cm) Interconnection length (Circuits/ns) Propagation medium

LEVELS OF PACKAGING
Level 0:bare chip as removed from the finished surface Level 1:bare chip mounted on a chip carrier & encapsulated as a packaged chip Level 2:printed circuit board with packaged chips, modules & other components Level 3:motherboard into which PCB are inserted. Level 4:electronic module Level 5:system formed by electronic module

Design Considerations
Hazards to be protected against: mechanical damage, exposure to weather and dirt, electromagnetic interference, etc. Heat dissipation requirements Tradeoffs between tooling capital cost and perunit cost Tradeoffs between time to first delivery and production rate Availability and capability of suppliers

Design Considerations (contd)

User interface design and convenience Ease of access to internal parts when required for maintenance Product safety, and compliance with regulatory standards Esthetics, and other marketing considerations Service life and reliability

Different variations in Packaging

Conventional Variation: one or more chips are attached to ceramic substrate via soldered joints Direct Chip Attach Module: The chip is attached directly on the card, called DCAM Multichip Module Laminate: The chip is attached via a cardlet,one of many small cards attached to a larger card, resulting in MCML

 Materials properties

Materials and Processing

Good insulating characters Low dielectric constant High thermal conductivity High strength and toughness Stability at the processing temperatures Thermal expansion near attachments Acceptable cost

Electronic Connections
DIP = dual-inline-package Developed in the 1960s Leads perpendicular to the body of the package

Surface Mount Technology (SMT) Method for constructing electronic circuits; components are mounted directly onto the surface of printed circuit boards Usually smaller than its leaded counterpart (because it has no leads or smaller leads).

Electronic Connections(contd)

Electronic Connections (contd)

Pin Grid Array (PGA) Integrated circuit is mounted on a ceramic slab Pins can then be inserted into the holes in a printed circuit board and soldered in place. This type of package occupies less space than older types such as the dual in-line package (DIL or DIP).

Electronic Connections (contd)

Quad Flat Package (QFP) Ceramic or plastic chip carrier Leads project down and away all four sides of a square package

Electronic Connection
Flip Chip- PGA Allows the microprocessor to operate more easily at its optimal temperatures by designing the processor core on the "flip side" (or backside) of the chip, facing away from the motherboard

Electronic Connections(contd)
Ball Grid Array- BGA Solution to the problem of producing a miniature package for an integrated circuit with many hundreds of pins.

Electronic Connections (contd)

Land Grid Array- LGA

Used by Intel to more evenly distribute power Less expensive than PGA and BGA

INTERCONNECTIONS
What are interconnections? It constitute the communications bottleneck of electronic digital system.

Types of interconnections
Electrical: These include Electrical conductors Wires Cables Connectors Optical Fibers

Uses of interconnections
Creating monopoly Introducing competition Protecting competition

What is Connector ?
An electromechanical system that provides a separable interface b/w 2 electronic subsystems without an unacceptable effect on signal integrity or loss in power

Connector Types
Three major connector types Board to Board Wire to Board Wire to Wire

Connector Applications
Signal Application: It span the range of current from microamps to hundred of milliamps.Driving voltages for this are generally a few volts. Power Application:It faces the additional requirement of thermal management.

Consideration for connectors

Two types of consideration Electrical Considerations Mechanical considerations

Electrical Considerations
Electrical consideration in connector selection include: Contact current ratings Contact resistance Contact impedance;capacitance &inductance Power rating Shielding and filtering requirements

Mechanical Considerations
Number of contacts Insertion/extraction force Number of expected connect/disconnect cycles Body style and profile Polarization and keying requirement Shock and vibration Area and height of connector Manual or automatic connector placement

Connector Problems
Signal Degradation: it is due to the faster clock rates and shorter rise time Cross Talk:it is caused by inductive and capacitive coupling b/w contacts There are mainly 2 types of crosstalk

Connector Problems(contd)
Backward (Near-end): it is measured at the driving end of the connector & represents the sum of capacitive and inductive coupling. Forward (Far-end): is measured at the receiving end of the connector & represents capacitive minus inductive coupling.

What are wires & cables ?

Selection of wires for interconnection involves several consideration Color coding Temperature rating Solid or stranded Individual,multi cable, flat cable Current carrying capacity

Wires & Cable(contd)

Temperature rating of wires depends on Test environment Assembly environment Use environment

Vibration
Problems of vibration There is a possible destruction or permanent damage to the circuit from the energy imparted by vibration. The circuit may operate out of its desired parameters during vibration

Prevention of vibration
The circuit elements should be mounted directly to a mechanically stiff substrate of printed wiring board. Employ sufficient hold down techniques to circuit assemblies & devices by staking through the use of adhesive interfaces and screws to reduce relative motion b/w components & their mounting surfaces. Leads should be soldered into position with very little prestressing. Signal wires RF cables should be clamped approx. 1-in intervals to prevent fraying during vibration

Prevention of vibration(contd)
Sensitive circuits should be packaged in a housing made from high-density materials such as steel or tungsten.

Reliability and Testing

What is Reliability and Testing in engineering? Packaging is backbone of electronics Employs almost every engineering discipline Easily affected by environmental factors Evaluate lifetimes of years in weeks

Reliability and Testing

Testing and Modeling

Air flow
Temperatures Deformation Stresses and solder fatigue

Reliability and Testing

Accelerate Failure Mechanisms - Temperature/humidity/voltage corrosion & migration - Thermal Accelerated oxidation, undesirable chemical processes - Mechanical Joint strength, shipping, cracks, de-lamination,

Future Trends in Electronic Packaging

Higher I/O, increased density Reduced voltage (noise sensitivity) Increased energy dissipation requirements Multiple voltage levels Higher operating frequency (RF range) Environmental constraints (Pb elimination)

THANK YOU